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Improvement in surface conditions of electroplated Fe-Pt thick-film magnets
http://hdl.handle.net/10069/38274
http://hdl.handle.net/10069/38274381debb5-bc68-4e52-8db2-477a01bf2de6
名前 / ファイル | ライセンス | アクション |
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AIPAdv8_56437.pdf (5.5 MB)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2018-06-06 | |||||
タイトル | ||||||
タイトル | Improvement in surface conditions of electroplated Fe-Pt thick-film magnets | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
著者 |
Yanai, T.
× Yanai, T.× Honda, J.× Hamamura, R.× Omagari, Y.× Yamada, H.× Fujita, N.× Takashima, K.× Nakano, M.× Fukunaga, H. |
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抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | Fe-Pt thick-films were electroplated on Ta, Ti, Co, Ni, and Cu plates (substrates) using a direct current, and the surface morphology, the magnetic properties, and the crystal structure of the films were evaluated. The films plated on the Co, Ni, and Cu substrates showed much smooth surface compared with those for the Ta and Ti ones, and we confirmed that the Cu plate was the most attractive substrate due to very small cracks after an annealing for L10 ordering. High coercivity (>800 kA/m) for the Cu substrate is almost the same as that for our previous study in which we employed the Ta substrate, and we found that the Cu plate is a hopeful substrate to improve the surface conditions of electroplated Fe-Pt thick-film magnets. | |||||
書誌情報 |
AIP Advances 巻 8, 号 5, p. 056437, 発行日 2018-05-01 |
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出版者 | ||||||
出版者 | American Institute of Physics | |||||
EISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 21583226 | |||||
DOI | ||||||
関連タイプ | isIdenticalTo | |||||
識別子タイプ | DOI | |||||
関連識別子 | 10.1063/1.5007196 | |||||
権利 | ||||||
権利情報 | c 2018 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). | |||||
著者版フラグ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
引用 | ||||||
内容記述タイプ | Other | |||||
内容記述 | AIP Advances, 8(5), 056437; 2018 |