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Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films
http://hdl.handle.net/10069/39801
http://hdl.handle.net/10069/39801a48f18de-df50-4777-bfa9-d20f150c6961
名前 / ファイル | ライセンス | アクション |
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MATERIALS13_1330.pdf (8.0 MB)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2020-04-14 | |||||
タイトル | ||||||
タイトル | Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films | |||||
言語 | ||||||
言語 | eng | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Pb-free soldering | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Sn-Zn alloy | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | electrodeposition | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | citric acid complex | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | enforced solid solution | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | thermal annealing | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | solder-joint | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | intermetallic compound | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | tensile strength | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | stress?strain | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
著者 |
Tsurusaki, Tatsuya
× Tsurusaki, Tatsuya× Ohgai, Takeshi |
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抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate from an aqueous solution containing citric acid complexes. The electrodeposition behavior of Sn-Zn alloys was classified to a normal co-deposition type, in which electrochemically nobler Sn deposits preferentially compared to Zn. Electrodeposited Sn-Zn alloy films were composed of a non-equilibrium phase, like an enforced solid solution, which was not observed in an equilibrium phase diagram of an Sn-Zn binary alloy system. By applying a thermal annealing process at 150 C for 10 minutes, a pure Zn phase was precipitated from an electrodeposited Sn-based solid solution phase with excessively dissolved Zn atoms. During the soldering process, intermetallic phases such as Cu3Sn and Cu5Zn8 were formed at the interface between an Sn-Zn alloy and Cu substrate. Tensile strength and fracture elongation of solder-jointed Cu rods with Sn-8 at.%Zn alloy films reached ca.40 MPa and 12%, respectively. |
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書誌情報 |
Materials 巻 13, 号 6, p. 1330, 発行日 2020-03-14 |
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出版者 | ||||||
出版者 | MDPI | |||||
EISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 19961944 | |||||
DOI | ||||||
関連タイプ | isIdenticalTo | |||||
識別子タイプ | DOI | |||||
関連識別子 | 10.3390/ma13061330 | |||||
権利 | ||||||
権利情報 | c 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). | |||||
著者版フラグ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
引用 | ||||||
内容記述タイプ | Other | |||||
内容記述 | Materials, 13(6), art.no.1330; 2020 |