@article{oai:nagasaki-u.repo.nii.ac.jp:00005565,
 author = {Yanai, Takeshi and Shiraishi, K. and Shimokawa, Takaya and Watanabe, Y. and Ohgai, Takeshi and Nakano, Masaki and Suzuki, K. and Fukunaga, Hirotoshi},
 issue = {17},
 journal = {Journal of Applied Physics},
 month = {May},
 note = {Electroplating of Fe films was carried out from choline chloride-ethylene glycol types of DES (Deep Eutectic Solvent). We investigated magnetic properties of the plated Fe films and evaluated the productivity for the electroplating process. Consequently, we found that surface morphology and current efficiency of the plated films were affected by the bath temperature. We obtained the Fe films with relatively smooth surface and high current efficiency in the bath temperature range from 70 to 110°C. The deposition rate for our process depended on the current density, and we obtained high deposition rate value of approximately 120μm/h. We also obtained high current efficiency values of approximately 90% in the wide range of plating time. These results indicate that the DES-based bath has industrial advantages for mass-producing Fe films. Therefore, we conclude that the DES-based bath is an attractive plating bath for Fe films., Journal of Applied Physics, 115(17), 17A344; 2014},
 title = {Electroplated Fe films prepared from a deep eutectic solvent},
 volume = {115},
 year = {2014}
}