@article{oai:nagasaki-u.repo.nii.ac.jp:00000631,
 author = {Tsurusaki, Tatsuya and Ohgai, Takeshi},
 issue = {6},
 journal = {Materials},
 month = {Mar},
 note = {Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate from an aqueous solution containing citric acid complexes. The electrodeposition behavior of Sn-Zn alloys was classified to a normal co-deposition type, in which electrochemically nobler Sn
deposits preferentially compared to Zn. Electrodeposited Sn-Zn alloy films were composed of a non-equilibrium phase, like an enforced solid solution, which was not observed in an equilibrium phase diagram of an Sn-Zn binary alloy system. By applying a thermal annealing process at 150  C for 10 minutes, a pure Zn phase was precipitated from an electrodeposited Sn-based solid solution phase with excessively dissolved Zn atoms. During the soldering process, intermetallic phases such as Cu3Sn and Cu5Zn8 were formed at the interface between an Sn-Zn alloy and Cu substrate. Tensile
strength and fracture elongation of solder-jointed Cu rods with Sn-8 at.%Zn alloy films reached ca.40 MPa and 12%, respectively., Materials, 13(6), art.no.1330; 2020},
 title = {Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films},
 volume = {13},
 year = {2020}
}