{"created":"2023-05-15T16:29:45.528663+00:00","id":631,"links":{},"metadata":{"_buckets":{"deposit":"1d13723c-c5e1-48c6-8c9a-538cb132cc61"},"_deposit":{"created_by":2,"id":"631","owners":[2],"pid":{"revision_id":0,"type":"depid","value":"631"},"status":"published"},"_oai":{"id":"oai:nagasaki-u.repo.nii.ac.jp:00000631","sets":["14:21"]},"author_link":["3216","3215"],"item_2_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2020-03-14","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"6","bibliographicPageStart":"1330","bibliographicVolumeNumber":"13","bibliographic_titles":[{"bibliographic_title":"Materials"}]}]},"item_2_description_4":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate from an aqueous solution containing citric acid complexes. The electrodeposition behavior of Sn-Zn alloys was classified to a normal co-deposition type, in which electrochemically nobler Sn\ndeposits preferentially compared to Zn. Electrodeposited Sn-Zn alloy films were composed of a non-equilibrium phase, like an enforced solid solution, which was not observed in an equilibrium phase diagram of an Sn-Zn binary alloy system. By applying a thermal annealing process at 150  C for 10 minutes, a pure Zn phase was precipitated from an electrodeposited Sn-based solid solution phase with excessively dissolved Zn atoms. During the soldering process, intermetallic phases such as Cu3Sn and Cu5Zn8 were formed at the interface between an Sn-Zn alloy and Cu substrate. Tensile\nstrength and fracture elongation of solder-jointed Cu rods with Sn-8 at.%Zn alloy films reached ca.40 MPa and 12%, respectively.","subitem_description_type":"Abstract"}]},"item_2_description_63":{"attribute_name":"引用","attribute_value_mlt":[{"subitem_description":"Materials, 13(6), art.no.1330; 2020","subitem_description_type":"Other"}]},"item_2_publisher_33":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"MDPI"}]},"item_2_relation_12":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"10.3390/ma13061330","subitem_relation_type_select":"DOI"}}]},"item_2_rights_13":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"c 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access  article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/)."}]},"item_2_source_id_8":{"attribute_name":"EISSN","attribute_value_mlt":[{"subitem_source_identifier":"19961944","subitem_source_identifier_type":"ISSN"}]},"item_2_version_type_16":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Tsurusaki, Tatsuya"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Ohgai, Takeshi"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2020-12-18"}],"displaytype":"detail","filename":"MATERIALS13_1330.pdf","filesize":[{"value":"8.0 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"MATERIALS13_1330.pdf","url":"https://nagasaki-u.repo.nii.ac.jp/record/631/files/MATERIALS13_1330.pdf"},"version_id":"e4192c61-c01d-4302-babb-0d35506f9198"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Pb-free soldering","subitem_subject_scheme":"Other"},{"subitem_subject":"Sn-Zn alloy","subitem_subject_scheme":"Other"},{"subitem_subject":"electrodeposition","subitem_subject_scheme":"Other"},{"subitem_subject":"citric acid complex","subitem_subject_scheme":"Other"},{"subitem_subject":"enforced solid solution","subitem_subject_scheme":"Other"},{"subitem_subject":"thermal annealing","subitem_subject_scheme":"Other"},{"subitem_subject":"solder-joint","subitem_subject_scheme":"Other"},{"subitem_subject":"intermetallic compound","subitem_subject_scheme":"Other"},{"subitem_subject":"tensile strength","subitem_subject_scheme":"Other"},{"subitem_subject":"stress?strain","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films"}]},"item_type_id":"2","owner":"2","path":["21"],"pubdate":{"attribute_name":"公開日","attribute_value":"2020-04-14"},"publish_date":"2020-04-14","publish_status":"0","recid":"631","relation_version_is_last":true,"title":["Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films"],"weko_creator_id":"2","weko_shared_id":-1},"updated":"2023-05-16T04:14:28.964307+00:00"}